JOB RESPONSIBILITIES:
-
Establish the test capability and the
capacity/productivity model.
-
Able to fully define and characterize
the designated process
-
Define the PCP and improving critical
test capability (as defined in the process control plan, product
drawings/ specification and BOM)
-
Fully understand the necessary
controls, equipment, precautions, setup parameters to meet the
product and test specifications.
-
Apply lean manufacturing principles to
eliminate waste in the production process and implement yield
improvement projects.
-
Responsible for the test yields of the
designated process. Responsible to establish and implement all
appropriate actions to improve the yields.
-
Responsible to conduct gage
repeatability & reliability studies, correlation studies as well
as actions to improve both these capabilities. Generate reaction
plans for OOC situations
-
Assist the manufacturing personnel in
operator training, qualification and improving operator utilization
and productivity as well as inventory reduction
-
Communication skill to communicate and
interface well with peers, enhance teamwork
-
Emotional intelligence
-
Derive Continual Improvement and use of
resources
-
Performing any other duties as directed
by the immediate superior from time to time.
-
Practice Risk Base Thinking in planning
and execution of task.
-
Compliance to ISO Requirements, company
rules & regulations, applicable codes etc.
JOB
REQUIREMENTS
-
Minimum: Masters/bachelors degree in
electrical/Electronics/Materials/Mechanical Engineering.
-
Minimum 5years of working experience in
wire bond process, preferably in the area of high speed devices
>1GHz.
-
Experience in MNC manufacturing
environment, preferably in metal can/TO can manufacturing line.
-
Solid DOE and SPC experience.
-
Good knowledge of FOL/semiconductor
processes.
-
Very good communication skills and
ability to work effectively in a cross functional environment with
people at all levels.